From 3 – 7 May 2021 over 250 conference presentations will be presented online to the public for the first time with the latest research findings and developments, including four outstanding, award-winning presentations. During the “PCIM Europe digital days” interested participants will have the opportunity to engage in intensive discussions with the award winners.
The winner of the PCIM Europe Best Paper Award:
Gustavo Fortes, LAPLACE University of Toulouse, France
Characterization of a 300 kW Isolated DC-DC Converter using 3.3 kV SiC-MOSFETs
The winners of the PCIM Europe Young Engineer Awards:
Christian Schwabe, Technical University of Chemnitz, Germany
Power Cycling Lifetime Investigation for Standard Packaged IGBTs under Low Temperature Swings and 50 Hz Load with Experiment and Simulation
Carsten Kempiak, Otto-von-Guericke-University, Germany
Accelerated Qualification of Highly Reliable Chip Interconnect Technology by Power Cycling Under Thermal Overload
Gard Lyng Rødal, Norwegian University of Science and Technology, Norway
An Adaptive Current Source Gate Driver for SiC MOSFETs with Double Gate Current Injection
Each award is endowed with prize money of 1,000 EUR. This year's conference sponsors are Infineon, Semikron, Mitsubishi Electric Europe and Wolfspeed.
PCIM Europe 2021 Best Paper Abstract:
Characterization of a 300 kW Isolated DC-DC Converter using 3.3 kV SiC-MOSFETs
Gustavo Fortes, Philippe Ladoux, Joseph Fabre, Didier Flumian, LAPLACE University of Toulouse, France
In the solid state transformers, efficiency is an essential criterion. It is recommended to have a high switching frequency to reduce filter elements, volume and mass of the transformer. Therefore, the concept of soft switching is indispensable to meet these constraints. This article presents an experimental comparison regarding two different current ratings 3.3kV SiC-MOSFETs and focuses on the influence on the converter efficiency caused by the output capacitances of the devices.
PCIM Europe 2021 Young Engineer Award Abstracts:
Power Cycling Lifetime Investigation for Standard Packaged IGBTs under Low Temperature Swings and 50 Hz Load with Experiment and Simulation
Christian Schwabe, Nick Thönelt, Peter Seidel, Josef Lutz, Thomas Basler, Technical University of Chemnitz, Germany
This paper focuses on the high cycle fatigue zone with low temperature swings for power modules, which is a new field in experimental testing. An advanced power cycling test concept, which can provide switching and conduction losses, was used. This combination allows accelerated testing with a load frequency of 50 Hz while avoiding overstressing devices with a current beyond specification. A design of experiments was developed and carried out with several million power cycling swings. Unexpectedly, the results can be fitted with standard models up to temperature swings of ΔT = 25 K. A wide range of simulations has been performed to further investigate the temperature distribution and the mechanical background. The mechanical simulation underlined the failure analysis which exposes solder layer degradation as a main failure mode for low temperature swings.
Accelerated Qualification of Highly Reliable Chip Interconnect Technology by Power Cycling Under Thermal Overload
Carsten Kempiak, Anton Chupryn, Andreas Lindemann, Otto-von-Guericke-University; Alexander Schiffmacher, Jürgen Wilde, Albert-Ludwigs-University Freiburg; Jacek Rudzki, Frank Osterwald, Danfoss Silicon Power, Germany
Highly reliable interconnects of an IGBT have been tested by power cycling. The test has been successfully accelerated by exceeding the specified operating conditions of the device. The approach is suitable to reduce the test time from several months to one day without changing the underlying failure mechanism, as revealed by experimental results and failure analysis. Additionally, a lifetime model is derived and compared to yet published models, revealing that the lifetime of modern power modules is much less affected by high temperatures, in particular when advanced interconnect technologies like silver-sintering are applied. Limitations and application examples are discussed as well.
An Adaptive Current Source Gate Driver for SiC MOSFETs with Double Gate Current Injection
Gard Lyng Rødal, Dimosthenis Peftitsis, Norwegian University of Science and Technology, Norway
This paper presents the design and operating principles of a novel current-source gate driver for Silicon Carbide metal oxide semiconductor field-effect transistors with adaptive functionalities that aims to improve controllability of 𝑑𝑖/𝑑𝑡 and 𝑑𝑣/𝑑𝑡 compared to conventional totem-pole voltage source gate drivers. The proposed gate driver is capable of providing a double injection of the gate current. This is achieved by means of incorporating a full-bridge circuit with energy storing inductors as well as an auxiliary switch for providing the second current pulse. The gate current can be adjusted by properly controlling the switching operations of the driver switches. The performance of the proposed adaptive current-source gate driver is validated by simulations and experiments. Experiments has verified the operating principle of the driver, while simulations have verified the driver’s ability to control turn-on/off delay times, 𝑑𝑖/𝑑𝑡 and 𝑑𝑣/𝑑𝑡.
The full conference program and further details about the “PCIM Europe digital days” are available at pcim-europe.com.
About Mesago Messe Frankfurt
Mesago, founded in 1982 and located in Stuttgart, specializes in exhibitions and conferences on various topics of technology. The company belongs to the Messe Frankfurt Group. Mesago operates internationally and is not tied to a specific venue. With 160 members of staff Mesago organizes events for the benefit of more than 3,300 exhibitors and over 110,000 trade visitors, conference delegates and speakers from all over the world. Numerous trade associations, publishing houses, scientific institutes and universities work with Mesago closely as advisers, co-organizers and partners. (mesago.com)
Background information on Messe Frankfurt
Messe Frankfurt is the world’s largest trade fair, congress and event organiser with its own exhibition grounds. The Messe Frankfurt Group employs around 2,500* people in a total of 30 subsidiaries. The company generated annual sales of approximately €250* million in 2020 after having recorded sales of €738 million the previous year. Even in difficult times caused by the coronavirus pandemic, we are globally networked with our industry sectors. We have close ties with our industry sectors and serve our customers’ business interests efficiently within the framework of our Fairs & Events, Locations and Services business fields. One of the Group’s key USPs is its closely knit global sales network, which extends throughout the world. Our comprehensive range of services – both onsite and online – ensures that customers worldwide enjoy consistently high quality and flexibility when planning, organising and running their events. We are expanding our digital expertise with new business models. The wide range of services includes renting exhibition grounds, trade fair construction and marketing, personnel and food services. Headquartered in Frankfurt am Main, the company is owned by the City of Frankfurt (60 percent) and the State of Hesse (40 percent).
For more information, please visit our website at: www.messefrankfurt.com
* preliminary figures 2020